4th United States Low Temperature Plasma Summer School
ISPC Summer School
ASPIRE Summer School

University of Minnesota, June 14 – 16, 2025

Organizers:

Peter Bruggeman, University of Minnesota, USA

Satoshi Hamaguchi, Osaka University, Japan

Gerrit Kroesen, Eindhoven University of Technology, Netherlands

Mark Kushner, University of Michigan, USA

The Summer School is co-located with the International Symposium on Plasma Chemistry (ISPC) at the University of Minnesota and has as goal to provide an opportunity for graduate students and early career researchers and engineers to be immersed in the fundamentals and applications of low-temperature plasmas and to learn from leading researchers in their field. There will be a special session on Plasma Materials Processing (PMP) for Microelectronics Fabrication.

Registration deadline: April 1st, 2025, or until the maximum number of participants is reached

Registration fee (including information): TBD

More details to follow shortly

Link to previous US summer schools

2022 (University of Minnesota)

2023 (University of Michigan)

2024 (University of Michigan)

First announcement

Lecturers

 

Job Beckers

Department of Applied Physics and Science Eduction, Eindhoven University of Technology, The Netherlands

 

Annemie Bogaerts

Department of Chemistry, University of Antwerp, Belgium

Bol

 

Ageeth Bol

Department of Chemistry, University of Michigan, Ann Arbor, USA

 

Uwe Czarnetzki

Department of Physics, Ruhr University Bochum, Germany

Chae

Heeyeop Chae

 Department of Semiconductor Convergence Engineering Sungkyunkwan University (SKKU), South Korea

 

Remi Dussart

GREMI, Groupe de Recherches sur l'Energétique des Milieux Ionisés UMR7344, CNRS/Université d'Orléans, France

 

 

Satoshi Hamaguchi

Graduate School of Engineering, Division of Materials and Manufacutering Science, Osaka University

Kuboi

 

Nobuyuki Kuboi

Research Division 2, Sony Semiconductor Solutions Corp., Kanagawa, Japan

Kushner

Mark Kushner

Department of Electrical Engineering and Computer Science, University of Michigan, USA

 

Pingshan Luan

Tokyo Electron Limited, Albany, NY, USA

 

Tsuyoshi Moriya

Tokyo Electron Technology Solutions Ltd. and University of Tsukuba, Japan

 

Daphne Pappas

Plasmatreat USA, Inc.

 

 

Shahid Rauf

Applied Materials, Inc., Santa Clara, CA, USA

 

Stephan Reuter

Engineering Physics Department, Polytechnique Montréal, Canada

 

Selma Mededovic Thagard

Department of Chemical and Biomolecular Engineering, Clarkson University, USA

 

Juan Pablo Trelles

Department of Mechanical and Industrial Engineering, University of Massachusetts Lowell, USA

This event is organized with the support of 

National Science Foundation logo, University of Minnesota logo, University of Michigan logo
asd
DOE