4th United States Low Temperature Plasma Summer School
ISPC Summer School
ASPIRE Summer School
University of Minnesota, June 14 – 16, 2025
Organizers:
Peter Bruggeman, University of Minnesota, USA
Satoshi Hamaguchi, Osaka University, Japan
Gerrit Kroesen, Eindhoven University of Technology, Netherlands
Mark Kushner, University of Michigan, USA
The Summer School is co-located with the International Symposium on Plasma Chemistry (ISPC) at the University of Minnesota and has as goal to provide an opportunity for graduate students and early career researchers and engineers to be immersed in the fundamentals and applications of low-temperature plasmas and to learn from leading researchers in their field. There will be a special session on Plasma Materials Processing (PMP) for Microelectronics Fabrication.
Registration is currently open for student participants at ISPC only (add on to conference registration)
Registration fee: $275
Please register for the ISPC meeting and at the following link.
Non-ISPC participants and non-students interested in attending the summer school, please send an expression of interest by filling in the following questionnaire by March 15, 2025.
Contact: [email protected]
Link to previous US summer schools
2022 (University of Minnesota)
Second Announcement and Lecture Topics
Lecturers
Igor Adamovich
Mechanical Engineering, Ohio State University, OH, USA
Job Beckers
Department of Applied Physics and Science Eduction, Eindhoven University of Technology, The Netherlands
Annemie Bogaerts
Department of Chemistry, University of Antwerp, Belgium
Ageeth Bol
Department of Chemistry, University of Michigan, Ann Arbor, USA
Uwe Czarnetzki
Department of Physics, Ruhr University Bochum, Germany
Heeyeop Chae
Department of Semiconductor Convergence Engineering, Sungkyunkwan University (SKKU), South Korea
Remi Dussart
GREMI, Groupe de Recherches sur l'Energétique des Milieux Ionisés UMR7344, CNRS/Université d'Orléans, France
Satoshi Hamaguchi
Graduate School of Engineering, Division of Materials and Manufacutering Science, Osaka University
Nobuyuki Kuboi
Research Division 2, Sony Semiconductor Solutions Corp., Kanagawa, Japan
Mark Kushner
Department of Electrical Engineering and Computer Science, University of Michigan, USA
Pingshan Luan
Tokyo Electron Limited, Albany, NY, USA
Masaaki Matsukuma
Tokyo Electron Technology Solutions Ltd., Japan
Tony Murphy
CISRO, Australia
Daphne Pappas
Plasmatreat USA, Inc.
Shahid Rauf
Applied Materials, Inc., Santa Clara, CA, USA
Stephan Reuter
Engineering Physics Department, Polytechnique Montréal, Canada
Selma Mededovic Thagard
Department of Chemical and Biomolecular Engineering, Clarkson University, USA
Juan Pablo Trelles
Department of Mechanical and Industrial Engineering, University of Massachusetts Lowell, USA
MingMei Wang
Lam Research Corporation, USA
This event is organized with the support of
